Compact Size
Standard Adapter
BGA device package + .079 inch (2.0mm)
Extraction Slot Adapter
BGA device package + .157 inch (4.0mm)
Standard Socket
same size as BGA device package
Extraction Socket (1.27mm Pitch and FR-4 1.00mm Pitch)
BGA device package + .079 inch (2.0mm)
Extraction Socket (Molded 1.00mm Pitch)
BGA device package + .138 inch (3.5mm)
Specifications
Terminals
Brass; Copper Alloy (C36000)
Plating (Terminals and Contacts)
Gold over Nickel
Body Material
F - FR-4 glass epoxy, U.L. Rated 94V-0, -40°C to 140°C (-40°F to 284°F)
[for RoHS Compliant applications]
M (1.27mm pitch) - Molded PPS (high temp. glass filled thermoplastic),
U.L. Rated 94V-0, -60°C to 260°C (-76°F to 500°F) [not for use in RoHS
Compliant applications due to processing temperatures - see new R
material below]
R (1.27mm pitch) - Molded LCP (high temp. glass
filled thermoplastic), U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F)
[for RoHS Compliant applications]
M (1.00mm pitch) - Molded LCP (high temp. glass filled thermoplastic),
U.L. Rated 94V-0, -40°C to 260°C (-40°F to 500°F) [for RoHS Compliant
applications]
Contacts
Beryllium Copper; Copper Alloy (C17200)
Standard Solder Ball
63Sn/37Pb, Eutectic, 183°C (361.4°F)
Lead-free Solder Ball
Tin/Silver/Copper Alloy, 218°C (424°F)
Socket Adapter Systems
Test Results for 1.27mm Pitch, Low Force Contacts (P/N 1427-1G) - Test Report No. 92351A
Durability
50 Cycles at 1 inch per minute, followed by Low Level Resistance Test.
3.1 m Ohm Average, +0.1 m Ohm average change
Vibration
MIL-STD 1344, Method 2005 Test, Condition III, 15 G's followed by Low Level Resistance Test.
2.8 m Ohm Average, -0.0 m Ohm average change
Gas Tight
Exposed in a sealed container to concentrated Nitric Acid (NHO3) followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.5 m Ohm average change
Moisture Resistance
Temperature cycling with humidity MIL-STD 1344, Method 1002, Type II, followed by Low Level Resistance Test.
3.4 m Ohm Average, +0.7 m Ohm average change
Shock
MIL-STD 1344, Method 2004, Test Condition A.
No mechanical damage or loss of continuity
Thermal Cycle
MIL-STD 1344, Method 1003, Test Condition A.
3.4 m Ohm Average, +0.7 m Ohm average change
Temperature Life
MIL-STD 1344, Method 1005, Test Condition 2.
3.8 m Ohm Average, +0.8 m Ohm average change
Porosity
MIL-STD 1344, Method 1017
No porosity
Contact Resistance
MIL-STD 1344, Method 3002, measured using 100m amp test current.
3.0 m Ohm average
Contact Force
Initial insertion force: 28.5g average (1.0 oz. average)
Initial withdrawal force: 18.5g average (0.7 oz. average)
Self Inductance*
2.52 nH Average at 1 GHz
Mutual Inductance*
2.26 nH Average at 1 GHz
*From Test Report No. 96313, consult factory for other frequencies.
View a typical soldering process example.
View a typical lead-free soldering process example.
0.80mm Pitch Models - SI Data
Superior Electrical Performance
Even with adjacent Aggressor excitation, our socket system provides a Differential Data path of ± 175mV @ 100psec and a Single-ended Data path of ± 125mV @ 140psec.
Differential Insertion Loss
-0.20dB @ 0.8 GHz
-0.40dB @ 1.4 GHz
Differential Return Loss
-15.0dB @ 0.8 GHz
-10.0dB @ 1.4 GHz
Single-ended Insertion Loss (Interior Pins)
-0.20dB @ 1.0 GHz
-0.60dB @ 2.0 GHz
Single-ended Insertion Loss (Exterior Pins)
-0.30dB @ 1.5 GHz
-0.70dB @ 2.9 GHz
Single-ended Return Loss
-15.0dB @ 1.0 GHz
-10.0dB @ 2.0 GHz
Insertion/Extraction Force
Consult Factory
Electrical Models for Download
0.80mm Pitch Signal Integrity Analysis and Modeling (SI Profiles, Crosstalk, Eye-Diagrams and Conclusions
in PDF format)
HSPICE Model
IBIS Model & Header Information
Touchstone Format (This file may be imported into either HSPICE or IBIS model simulators.)
1.00mm Pitch Models - SI Data
Superior Electrical Performance
Even with adjacent Aggressor excitation, our socket system provides a Differential Data path of ± 175mV @ 100psec and a Single-ended Data path of ± 125mV @ 140psec.
Differential Insertion Loss
<-0.10dB @ <1.5 GHz
-0.20dB @ 3.1 GHz
Differential Return Loss
-15.0dB @ 1.5 GHz
-10.0dB @ 3.1 GHz
Single-ended Insertion Loss (Interior Pins)
<-0.10dB @ GHz
-.060dB @ 2.0 GHz
Single-ended Insertion Loss (Exterior Pins)
-0.20dB @ 4.8 GHz
-0.60dB @ 7.6 GHz
Single-ended Return Loss
-15.0dB @ 2.8 GHz
-50.0dB @ 5.4 GHz
Insertion/Extraction Force
Consult Factory
Electrical Models for Download
1.00mm Pitch Signal Integrity Analysis and Modeling (SI Profiles, Crosstalk, Eye-Diagrams and Conclusions
in PDF format)
HSPICE Model
IBIS Model & Header Information
Touchstone Format (This file may be imported into either HSPICE or IBIS model simulators.)