An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. Our low insertion force, patented design provides yields that are equivalent to direct attach, with coplanarity consistently better than the industry standard of .006" (0.15mm).
- Protects valuable PC boards and subjects device to lower thermal stress.
- Same footprint as BGA device.
- Multifingered, high reliability contacts and screw-machined terminals for superior reliability.
- Value-added features such as eutectic SnPb and lead-free SnAgCu solder balls, kapton seal, and tape and reel packaging reduce processing and application costs.
- RoHS Compliant insulators and terminals are compatible with
lead-free processing - select new lead-free solder ball terminals for SMT
applications
Contact customer service for custom applications.
