Advanced Interconnections Corp. is the world's leading manufacturer of IC sockets and adapters for Ball Grid Array (BGA) package devices. Advanced's patented eutectic solder ball terminals are standard on all of our BGA sockets for proven long-term performance in vigorous temperature cycling applications. Sockets and adapters for production and test applications are available in standard and custom configurations (surface mount and thru-hole) for high density packages down to .0315"(0.8mm) and .0295"(0.75mm) pitch. Space-saving designs do not require external hold-downs, maximizing valuable printed circuit board (PCB) space. Full line of test emulator adapters also available.